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"Cabinet Integrated Liquid Cooling Supports Rising Power Density & Maximum Sustainability for High-Performance Computing Data Center Environments"

Liquid cooling technology removes heat more effectively than air to enable higher power densities and improved sustainability.

The demand for digital services and high-performance computing (HPC) technologies, such as artificial intelligence (AI), machine learning (ML), and advanced data analytics is increasing rapidly. As a result, power density requirements in the data center industry are reaching new heights, rising from an average of 2.4 kilowatts (kW) in 2011 to 8.4 kW in 2020. This increase in power density leads to higher heat generation and necessitates effective cooling solutions to prevent equipment failure and costly downtime. Liquid cooling technology has emerged as an efficient solution to address these challenges, removing heat more effectively than air to enable higher power densities and improved sustainability.

Learn more about two-phase direct-on-chip liquid cooling as it is emerging as the most favorable choice today due to its ease of adoption, lower deployment costs, superior reliability, higher efficiency, and enhanced sustainability. 

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