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"Achieving Chip Cooling at 1000W and Beyond with Single Phase Precision Liquid Cooling"

As AI proliferates, one cooling solution holds the key to supporting dense IT equipment: Precision Liquid Cooling. Learn more in this white paper.

The prominence of liquid cooling is surging within the data center industry, notably driven by the advancements in generative AI technology. Despite its presence in the market for over a decade, liquid cooling technology was primarily confined to the high-performance computing sector without widespread adoption. 

As compute densities and the overall thermal design power of IT equipment rise, the industry has latched onto liquid cooling as a sustainable solution for solving these challenges. In this white paper, Iceotope presents extensive testing to demonstrate liquid cooling’s capacity to facilitate chip-level cooling up to and beyond 1000W — a key capability that dense IT equipment will require in the next three years to support AI.

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